Events

enLabel Global Services will be joining Epson at PACK EXPO International 2016, at McCormick Place, on November 6-9, in Chicago, Illinois. With 45,000+ attendees from 40+ vertical markets, 7,000+ international buyers from 130+ countries, and more than 2,100+ exhibiting companies occupying nearly 1.2 million net square feet, this tradeshow will be the world’s largest main event for processing and packaging innovations in 2016.

enLabel Global Services is the first-time Bronze Sponsor for this event. The conference will focus on designing flexible labeling systems to manage global regulatory requirements, adopting precise language that is easily translatable and culturally transferable, enhancing labeling processes and protocols to achieve compliance with impending global UDI requirements, and much more.

April 25-26 in Alexandria, VA
Hosted by Q1 Productions

enLabel Global Services is the proud Gold Sponsor and Keynote Speaker for this event. The conference will focus on complying with evolving labeling & UDI requirements on the international level, as well as focusing on enhancing operational management of label development & approval and exploring software & tools to support labeling needs.